Combined Glossary Table
| term | description | facets
| | 5/5 | 5mil minimum traces & 5mil minimum spacing |
| 6/5 | 6mil minimum traces & 5mil minimum spacing |
| AMC | aluminum metal core |
| ACY |
| additive |
| Adhesive |
| Altium |
| Annular Ring |
| Annulus |
| AOI automatic optical inspection |
| Aperture |
| Arc |
| Array |
| assembly |
| AutoCAD |
| autorouter |
| Autotrax |
| Autotrax |
| AXI automated x-ray inspection |
| Axial |
| Bakelite |
| BGA |
| Blind Via |
| bloat |
| board house |
| Board Thickness |
| Breadboard |
| buffer |
| Buried Via |
| bus |
| C4 Controlled collapse chip connection |
| CAD |
| CAM files |
| CAM |
| Capture |
| Card Edge connector |
| Castellations |
| CEM-1 |
| CEM-3 |
| Centroid |
| centroid |
| Chip Scale Package |
| clad |
| Clearance |
| Coating (Spin, Roll, Film) |
| COB |
| Component Side |
| Component |
| Computer Aided Design |
| Computer Aided Machining |
| Conformal Coating |
| Conformal coating |
| connect |
| Copper Foil |
| Copper weight |
| Copper |
| copper |
| courtyard |
| cte coefficient of thermal expansion (see tce) |
| Curve, open |
| delamination |
| DFSM Dry film soldermask |
| Dialectric |
| Diameter |
| Dielectric |
| differential pair |
| DIP |
| Discrete Component |
| double-sided |
| DRC design rule check |
| Drill file |
| Eagle |
| EDF |
| EDI Electronic Data Interchange |
| Endpoint |
| ENIG Electroless Nickel Immersion Gold |
| epoxy resin |
| ESD Electrostatic Discharge |
| Etching |
| Excellon |
| explicit layer |
| fabrication fab |
| Feedthrough Via |
| fidocad |
| Fiducial |
| Finger |
| Finite Element Filter |
| Fixture |
| flags |
| Flex |
| Flip chip |
| flood fill |
| Flux |
| Flying probe |
| Foil |
| font |
| Footprint |
| FR-1 |
| FR-2 |
| FR-3 |
| FR-4 |
| Gcode |
| gEDA |
| Gerber |
| grid snap |
| grid-pitch |
| grid |
| Hard Gold pcb surface finish (slip rings, fingers, etc) |
| HASL Hot Air surface levelling |
| High Density Interconnect(HDI) |
| Hole |
| Immersion Silver |
| Immersion Tin |
| implicit layer |
| Integrated Circuit |
| IPC (circa 1957) |
| JIT |
| Kapton |
| KiCAD |
| Knife |
| Laminate |
| Land |
| Laser |
| Layer Group |
| Layer Sequence |
| Layers (Physical) |
| Layers (Virtual) |
| Library |
| Lihata |
| mask |
| Masonite |
| Mentor |
| Mil |
| Milling |
| milling |
| Mirroring |
| Mouse bites |
| Multilayer |
| neckdown |
| negative process |
| Negative transfer |
| NEMA |
| Net |
| Netlist |
| ODB++ |
| OrCAD |
| OSP Organic Solderability preservative |
| outline |
| Package |
| Pad |
| padstack |
| Panel Service |
| panel |
| Panelization |
| paste stencil |
| paste |
| Path |
| pcb-rnd |
| PCB |
| PDIP |
| phenolic resin |
| Photoengraving |
| Photoresist |
| pick and place pnp |
| Pin |
| pinout |
| pitch |
| PLCC plastic lead chip carrier |
| plotter |
| Polygon hole |
| Polygon, complex |
| Polygon, concave |
| Polygon, convex |
| Polygon, irregular |
| Polygon, regular |
| Polygon, simple |
| Polygon |
| polygon |
| positive process |
| Positive transfer |
| Protel |
| PTH |
| Pyralux AP |
| Pyralux FR |
| Pyralux LF |
| QFP |
| Radial Lead |
| Raster |
| rat |
| Ratsnest |
| refdes Reference Designator, https://en.wikipedia.org/wiki/Reference_designator |
| reflow |
| Registration |
| resin |
| resist |
| RF |
| Rigid-Flex |
| Route and Retain |
| routing style |
| Routing |
| routing |
| RS-274D |
| RS-274X |
| Rubylithe |
| Scoring |
| Short |
| Silk Screen |
| Silk |
| silk |
| single-sided |
| SIP |
| slot |
| SMD |
| SMOBC soldermask over bare copper prevent unintended flow of tin/lead during reflow |
| SMT |
| Snap |
| SOIC |
| Solder Side |
| Solder |
| STEP |
| Subcircuit |
| Substrate |
| Subtractive |
| Symbol |
| Tape out |
| TCE thermal coefficient of expansion |
| tEDAx |
| Tented(Via) |
| terminal |
| TG Glass transition temp |
| Thermal Via Thermal relief |
| Thou |
| Tin Whisker |
| Tin |
| TinyCAD |
| Tolerance |
| tombstone |
| tooling |
| toolpath generator |
| toolpath |
| toporouter |
| Trace |
| TT toner transfer |
| V-Cut aka v-scoring |
| V-score |
| Vcc |
| Vdd |
| Vector |
| Via stitching |
| Via |
| Wave Solder |
| Wire bonding |
| XY |